It’s highly possible that Apple could use the name iPhone 6SE for the lineup that is going to be announced during the month of September. If this latest revelation turns out to be true, then the number ‘7’ could be used for the iPhone family that is going to be introduced in 2017.
iPhone 6SE Could Seem Like The Logical Approach – Minor Differences Between Predecessors Suggest Such A Name Was Chosen Wisely
From what we know so far, iPhone 6SE is going to be sold in the following color models:
- Gold
- Rose Gold
- Space Black
One of the reasons why Apple could choose the name iPhone 6SE for its upcoming family is because from the leaks that we have seen so far, there are hardly any new differences separating iPhone 6s from its successor, unless of course you’d like to call the 14 percent battery increase in the upcoming phone an improvement (1,960mAh battery has been reported to be present inside). Perhaps when iPhone 7 is officially announced next year, we could be seeing some truly remarkable changes, such as an OLED panel and support for wireless charging.
From a hardware perspective, the upcoming iPhone 6SE three models are going to feature an A10 SoC, and from the looks of it, the chipset is powerful, but not as much as we would want it to be. The phone could also feature LTE modems from two different companies, and we believe that the phablet sized brothers are going to feature a 3,100mAh battery, which is huge even by Apple standards, along with on-board storage increased to 256GB. We expect that 256GB will be nice little upgrade for those who have capped their 128GB internal memory (for a premium price obviously).
At this point, we’re not too sure if the upcoming smartphone is going to feature a 3.5mm headphone jack or not, but rumors circulating suggest that the packaging of the handset will include an adapter to attach your expensive 3.5mm headphones or earphones, along with support for wirelessly charging the smartphone.
Apple is also said to adopt a new chip developing technology called FoWLP, which stands for fan-out wafer level packaging platform. With this technology, smartphone OEMs can greatly reduce the thickness of their mobile devices since FoWLP does not require a PCB. Additionally, it is able to increase the efficiency of chips by 30 percent and reduce the thickness of smartphones by at least 0.3mm. We bet Apple’s ears must be ringing when they were pitched that smartphone thickness could be using by employing this technology in mobile devices.
Do you feel that the name iPhone 6SE fits well with the upcoming family? Let us know your thoughts immediately.
