Qualcomm already employs the use of the 10nm architecture for its Snapdragon 835, and while it has been rumored that the Snapdragon 845 will take advantage of the same lithography for the upcoming Galaxy S9, the chipset manufacturer has also been reported to give the upcoming Snapdragon 670 the same treatment.
Snapdragon 670 Rumored to Get 10nm LPP Process, Octa-Core 3rd-Generation Processors, and ARM’s DynamIQ Tech
Rumor originating out of China claims that Qualcomm will be taking advantage of the more efficient 10nm LPP, or Low Power Plus process, giving the Snapdragon 670 the ability to deliver additional performance and exhibit greater efficiency than those SoCs manufactured using the LPE or Low Power Early technology.
The rumor also states that the SoC will take advantage of two power Kryo 360 cores coupled with six low-powered Kryo cores for an octa-core package. The power-cores will be using Qualcomm’s 3rd-generation core technology, being able to deliver the necessary punch where needed while also resonating impressive levels of efficiency to keep that unnecessary battery level consumption down to a minimum.
The Kryo 360 is something that we might find in the Snapdragon 845 so we will provide you with additional details when the info reaches our ears. Another thing discussed in the rumor was ARM’s DynamicIQ technology. For those that are unaware of what this means, DynamicIQ technology is ARM’s step-up from its big.LITTLE architecture, where the device will be able to display greater efficiency and remain cooler due to unnecessary power draw from the battery.
This, combined with the fact that the Snapdragon 670 has been rumored to be manufactured on the 10nm LPP process gives way to the idea that mid-ranged devices will be bridging the performance and efficiency gap between devices that will be using a Snapdragon 845 inside their compact chassis.
The Snapdragon 670 could also provide another breakthrough; allowing mid-ranged phones to tout facial recognition and an in-display fingerprint sensor according to what Qualcomm has been working on for its next-gen chipsets.
There is definitely too much information flowing through regarding this so we want you all to take a break, and take a pinch of salt regarding this, and we’ll be back with more info.
News Source: Twitter (@mmddj_china)
